Built to catch
Micron-Level Defects
...before they cost you
Semiconductor complexity demands smarter tools
Get the free guide to learn how Cognex helps manufacturers catch the tiniest defects, navigate supply chain risks, and meet sustainability goals.
Trusted by 25,000+ brands worldwide
Your roadmap to smarter chip production
Your chips are getting smaller. Your processes more complex. Your margins tighter than ever.
Cognex vision systems deliver wafer defect inspection, wafer notch & alignment, and wire bond & probe mark inspection with unmatched speed and reliability.
Detect defects early, align wafers with consistent accuracy, and verify critical features—so you can improve yield, reduce scrap, and scale with confidence.
One defect can cost millions
We help you catch issues before they escalate
Wafer Defect Inspection
Inspect earlier. Protect more wafers.
Micro-cracks, scratches, contamination—modern wafer defect inspection requires detection beyond the limits of human vision. Cognex AI-powered vision systems identify and classify defects early in the process, reducing downstream waste and safeguarding yield.
With high-resolution imaging and rule-based + AI tools, you can perform wafer surface analysis on every unit without slowing production.
Wire Bond & Probe Mark Inspection
No missed defects. No unnecessary failures.
Wire bond inspection and probe mark inspection are essential to ensuring device functionality and long-term reliability. Any defects, like missed bonds, deformation, or over-travel, can compromise device integrity.
Cognex systems combine 2D/3D inspection and AI-driven classification to detect and categorize bond defects and probe marks —enabling better process control and preventing downstream failures.
Wafer Notch & Alignment
Precision starts with reliable positioning
Accurate wafer notch detection and wafer die alignment are essential for keeping each process step within tolerance. Cognex systems locate wafer notches with sub-pixel accuracy —even on opaque or reflective wafers—ensuring consistent positioning for downstream processes.
Built-in compensation for skew and rotation maintains process accuracy in high-throughput lines, supporting both FOUP and open cassette carriers.
Stop defects from slipping through the cracks.
Our AI-powered inspection and traceability tools help semiconductor manufacturers detect anomalies early, reduce scrap, and maintain production integrity.
Semiconductor manufacturer, Heidelberg Instruments
increases yield from 66% to 95% with Cognex machine vision.
"By using imaging specialists like Cognex, we can implement modules such as their image recognition into our toolset and achieve improved output compared to using only our solution."
―Konrad Roessler
Chief Executive Officer
Why leading semiconductor manufacturers
Choose Cognex
AI + rule-based tools
Perform standard and advanced inspections with one platform
2D & 3D smart cameras
Designed for semiconductor-grade precision and reliability
Modular and scalable
Reconfigure quickly for new wafers, SKUs, or processes
Global partnerships
Trusted by leading fabs and assembly/test facilities worldwide
25,000+
global customers
1,100+
technology patents
500+
global customer support resources
Transform your operations today.
See our semiconductor solutions in action – claim your free demo now.
FAQs for Semiconductor Inspection & Traceability
What types of wafer defects can Cognex systems detect?
Cognex vision systems can detect surface particles, cracks, scratches, edge chipping, and contamination. Our high-resolution imaging and hybrid AI + rule-based tools ensure consistent detection at every stage of wafer processing.
Can your systems handle both notch detection and die alignment?
Yes! Cognex solutions provide precise notch detection with sub-pixel accuracy and automatic compensation for skew, shift, and rotation—even on reflective or opaque wafers.
How accurate are your wire bond and probe mark inspections?
Our systems detect defects such as bond lift, flash, deformation, and misalignment with high accuracy. Probe marks are classified for size, location, and count, helping you identify critical issues before final testing.
Do I need AI expertise to use these systems?
No! Our solutions are built for ease-of-use, with intuitive interfaces and guided setup. Applications can be deployed and re-trained quickly—even without a dedicated vision engineer.
Can one vision system be used across multiple applications?
Yes! Cognex smart cameras and vision tools are modular and scalable. With the right lenses, filters, and software configurations, systems can be repurposed across different lines or inspection tasks.
What makes Cognex vision systems reliable for semiconductor environments?
Cognex solutions are built for high-speed, high-volume manufacturing. They deliver consistent performance under variable lighting, reflective surfaces, and tight tolerances—common in semi fabs and assembly/test lines.
How do your systems support traceability?
Cognex offers advanced 2D barcode readers with embedded AI that reliably read codes on challenging surfaces like wafers and packages, ensuring complete traceability throughout production.
What’s required to integrate these systems into our existing lines?
Our solutions are designed for fast deployment with minimal disruption. We offer integration support, API options, and flexible mounting to fit within existing equipment footprints.
Do you offer global support and training?
Yes! Cognex provides self-service resources, online tools, and hands-on training, supported by a global network of engineers available for on-site or remote assistance.
Can I test your solution before committing?
Yes! We offer product demos, lab kits, proof-of-concept evaluations, and application reviews to confirm the solution meets your needs before full deployment.
Talk to an expert: 855-426-4639
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Cognex Corporation | 1 Vision Drive | Natick, MA 01760 | USA